Application of Photosensitive Resins to Microengineering Target Components

The field of laser fusion involves the development of new technologies to aid in the fabrication of miniature components used in the target drive system. Current techniques range from cnc lathing with ultra-precise diamond turning to electroplating and mechanical punching. These techniques are labour intensive and are unsatisfactory for many applications. This paper outlines techniques adopted from the microelectronics industry, which have been developed to fabricate these components using a process known as Microengineering. This approach allows the mass-production of these devices with the diversity required to alter dimensions, profile, and material depending on the application ^1,2. These microengineering processes have allowed a variety of materials to be investigated with various geometrical features and surface topographies. Using thick photosensitive polymers, combined with electroplating processes, complex 3-D structures have been fabricated in multiple stages.