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Characterization of the Microshell Surface Using Holography

C. Hermerel, A. Choux, L. Jeannot, E. Busvelle, P. Merillot, O. Legaie

Fusion Science and Technology / Volume 59 / Number 1 / January 2011 / Pages 110-115

Technical Paper / Nineteenth Target Fabrication Meeting / dx.doi.org/10.13182/FST11-A11511

To characterize the shape, the quality, and the roughness of microshells, digital holographic microscopy technology is used because it offers an appropriate ability to these studies. It captures holograms to reconstruct a double image, one for the intensity and another one for the phase. Using rotation axis, bump counting for the complete microshell surface is possible with a very high speed. Using image stitching and three-dimensional surface rebuilding software, mapping can be done in a few minutes. Each bump can then be characterized on the map by its position, diameter, and height.